Part Number Hot Search : 
CP106D 224K8RAC RC288 IS93C FDLL4148 H15006GP BAS70 T310C1
Product Description
Full Text Search
 

To Download 76001-0010 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 FEATURES AND SPECIFICATIONS
Z-Power is a high-current, rigid, board-to-board and wire-to-board mezzanine style interconnect designed to transfer power loads from one PCB to another Z-Power connectors utilize a unique, dual interface which results in long-term reliability. The Z-Power connector allows 50.0A to be carried between parallel boards in 0.232 in2, with less than .020 milliohms initial plane-to-plane resistance. The Z-Power connector is press-fit into the PC base board. The PC top board is then screwed down on top of the Z-Power connector, forming a high-pressure interface. A unique, dual Hertzian contact design allows the screw to be installed without affecting the compliant-pin interface in the opposing PCB. Features and Benefits n 50.0 and 30.0A versions available to cover a variety of applications n Low contact resistance is ideal for high-current applications n Compliant-pin interface provides a solderless termination n Rigid, screw-down interface ensures a highpressure, reliable contact SPECIFICATIONS Reference Information Packaging: Tray UL File No.: 1792321 Designed In: Millimeters Electrical Voltage: 600V Current at 30C 10 Circuit - 50.0A 6 Circuit - 30.0A Contact Resistance: Beginning of Life: 10 Circuit 0.18 milliohms max. 6 Circuit 0.30 milliohms max. End of Life: 10 Circuit 0.25 milliohms max. 6 Circuit 0.40 milliohms max. Insulation Resistance: 5000 Megohms min. Mechanical Insertion Force to PCB: 9.07N (20lbf) per tail Recommended Torque: 0.75 N-m (6.6 Inch-lbs) Durability: 5 cycles mate/un-mate (bolt interface) Physical Housing: LCP Contact: Copper (Cu) Alloy Plating: Contact Area - 30m" min. Gold (Au) or 100m" Tin (Sn) min. Solder Tail Area - 100m" min. Select Matte Tin (Sn) Underplating - 50m" min. Nickel (Ni) PCB Thickness: 2.36mm (.093") min. Operating Temperature: -40 to +105C n Patented internal terminal design relieves stress on press-fit pins from shock and vibration n Captured internal nut provides for ease of assembly n Board-to-board or wire-to-board interface provides flexible design options The rigid nature of this interconnect allows high-density PCB applications to benefit from real-estate savings, by employing Z-Power in a dual role. Z-Power performs as both a high-reliability power connector and a durable stand-off, relieving the need for separate mechanical stand-offs in some applications. Z-Power can also be used as an efficient, wire-to-board connector. This application is achieved through using standard wire-crimp, ring-lug terminals as the mating interface to the Z-Power screw-down terminal interface.
Z-PowerTM Connector 10.30mm (.405") Parallel Board Spacing Mezzanine, Board-to-Board and Wire-to-Board Applications 76001
30.0 and 50.0A Z-Power Connectors
APPLICATIONS
Z-PowerTM Connector 10.30mm (.405") Parallel Board Spacing Mezzanine, Board-to-Board and Wire-to-Board Applications 76001
n Z-Power is a 10.30mm (.405") parallel board-spacing, board-to-board and wire-to-board connector n Designed for high-current power transfer from one PCB to another, utilizing a press-fit termination into the base board, and a screw-down termination to the top board n With 50.0 and 30.0A sizes, Z-Power can be used in a variety of applications and industries where power connections between parallel boards is necessary
10.30mm (.405")
Wire-to-Board Application Board-to-Board Application
ORDERING INFORMATION Z-Power Headers
Order No. Current (A ) PC Press-Fit Tails Plating
76001-0006 76001-0106 76001-0010 76001-0110
30 50
6 10
Gold Tin Gold Tin
Suggested Ring Terminals for Wire-to-Board Applications
Order No. Wire AWG Thread Size Thread Length
19193-0128 19073-0216 19193-0199
8 10
M3 X 0.05
5.00mm (.196")
Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX amerinfo@molex.com
Order No. 987650-0877
Asia Pacific North Headquarters Asia Pacific South Headquarters European Headquarters Yamato, Kanagawa, Japan Jurong, Singapore Munich, Germany 81-462-65-2324 65-6268-6868 49-89-413092-0 feninfo@molex.com fesinfo@molex.com eurinfo@molex.com Visit our website at www.molex.com/product/zpower.html
Printed in USA/JI/2007.06
Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352
(c)2007, Molex


▲Up To Search▲   

 
Price & Availability of 76001-0010

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X